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SEB 330
Term 7
3 credits

Metrology, Inspection and Defect Analysis

Students will learn fundamental principles of measurement science, advanced inspection tools, and methodologies for identifying, characterizing, and resolving defects in semiconductor devices. Topics include optical, electrical, and physical metrology, statistical process control, and failure analysis techniques. The course emphasizes practical applications, ensuring graduates can uphold stringent quality standards in high-volume production environments.

Course outline

Lectures, virtual labs, and graded assignments — completed in your browser.

01Introduction to Metrology and Semiconductor Manufacturinglecture
02Fundamentals of Measurement and Statistical Process Control (SPC)lecture
03Optical Microscopy and Advanced Imaging Techniqueslecture
04Scanning Electron Microscopy (SEM) and Energy-Dispersive X-ray Spectroscopy (EDS)lecture
05Atomic Force Microscopy (AFM) and Surface Profilometrylecture
06Thin Film Metrology: Thickness, Stress, and Composition Analysislecture
07Electrical Test and Characterization Methodslecture
08Contamination Control and Particle Detectionlecture
09Yield Management and Defect Classificationlecture
10Front-End-of-Line (FEOL) Metrology and Inspectionlecture
11Back-End-of-Line (BEOL) Metrology and Inspectionlecture
12Failure Analysis Techniques and Root Cause Identificationlecture
13Advanced Metrology Challenges and Emerging Technologieslecture
14Final Project Presentations and Course Reviewlecture

Syllabus

Each week features online lectures, readings, and practical simulation exercises focusing on a specific metrology or inspection topic. Students are expected to actively participate in discussion forums, complete weekly assignments, and contribute to a final defect analysis project. Assessments include quizzes, lab reports on virtual metrology tools, and a final exam. Academic integrity is paramount, requiring all submitted work to be original. Timely submission of assignments is crucial; late work may incur penalties. Professional conduct and clear communication are expected in all interactions.